vivi.kang@szfitech.com
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福英达
福英达

Shenzhen Fitech Co., Ltd.

Fitech’s Ultra-Fine Solder Assists in Innovation

Shenzhen Fitech Co.,Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry.

 

The company offers a comprehensive product line, ranging from alloy solder powders to ultra-fine soldering application products. It is currently the only manufacturer in the world capable of producing microelectronics and semiconductor packaging materials in the full range of ultra-fine alloy solders, from T2 to T10.

 

Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of alloy solder powders are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries.

 

 

 

 

 

 



Shenzhen Fitech Co., Ltd.
Shenzhen Fitech Co.,Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry. With world-class research and development capabilities in microelectronics and semiconductor packaging solder materials, Fitech is committed to creating value for its customers through exceptional products and services, striving to become the best partner in the global microelectronics and semiconductor packagin

Shenzhen Fitech Co., Ltd.

Fitech’s Ultra-Fine Solder Assists in Innovation
Shenzhen Fitech Co., Ltd.

Shenzhen Fitech Co.,Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry.

 

The company offers a comprehensive product line, ranging from alloy solder powders to ultra-fine soldering application products. It is currently the only manufacturer in the world capable of producing microelectronics and semiconductor packaging materials in the full range of ultra-fine alloy solders, from T2 to T10.

 

Fitech’s ultra-fine solder pastes, fluxes, and full size and variety of alloy solder powders are widely applied across various sectors of microelectronics and semiconductor packaging. These products have gained widespread recognition from global SMT electronic chemical manufacturers, micro-optoelectronic manufacturers, and semiconductor packaging and testing companies. The company has established stable and long-term business partnerships with clients in over 20 countries.

 

 

 

 

 

 



Shenzhen Fitech Co.,Ltd. is a global leader in providing soldering solutions for microelectronics and semiconductor packaging, with over 20 years of dedicated experience in the industry. With world-class research and development capabilities in microelectronics and semiconductor packaging solder materials, Fitech is committed to creating value for its customers through exceptional products and services, striving to become the best partner in the global microelectronics and semiconductor packagin
2023
2023
Certificates of the National SRDI Little Giant Enterprise and completed IATF16949 certification.
2022
2022
Certificates of Shenzhen SRDI Enterprise.Low-temperature high-strength solder FL series was authorized by China, Japan and USA to obtain patents.
2021
2021
Certificates of ISO14001-2015, ISO9001-2015 and QC080000-2017.
2020
2020
Launch of water-soluble solder paste and gold-tin solder powder/solder paste.
2019
2019
Introduced solder paste products for mini/micro LED.
2017
2017
Certificates of the National High-Tech Enterprise and Shenzhen High-Tech Enterprise.
2016
2016
Low-temperature high-strength solder FL170/180/FL200 were developed.
2015
2015
The company was relocated to the Bao’an Industrial district, improving its research and development abilities.
2014
2014
Scale production of ultra-fine solder powder and die attach solder paste and is the only company that can produce T2-T10 solder materials.
2010
2010
A production rate of 1500t/year for centrifugal atomization solder power.
2006
2006
A production rate of 220t/year for ultrasonic atomization solder powder.
1997
1997
The establishment of Fitech in Shekou.

发展历程

development path

2023
Certificates of the National SRDI Little Giant Enterprise and completed IATF16949 certification.
2023
2022
Certificates of Shenzhen SRDI Enterprise.Low-temperature high-strength solder FL series was authorized by China, Japan and USA to obtain patents.
2022
2021
Certificates of ISO14001-2015, ISO9001-2015 and QC080000-2017.
2021
2020
Launch of water-soluble solder paste and gold-tin solder powder/solder paste.
2020
2019
Introduced solder paste products for mini/micro LED.
2019
2017
Certificates of the National High-Tech Enterprise and Shenzhen High-Tech Enterprise.
2017
2016
Low-temperature high-strength solder FL170/180/FL200 were developed.
2016
2015
The company was relocated to the Bao’an Industrial district, improving its research and development abilities.
2015
2014
Scale production of ultra-fine solder powder and die attach solder paste and is the only company that can produce T2-T10 solder materials.
2014
2010
A production rate of 1500t/year for centrifugal atomization solder power.
2010
2006
A production rate of 220t/year for ultrasonic atomization solder powder.
2006
1997
The establishment of Fitech in Shekou.
1997
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Fitech Provides Services for Customers Globally

With Microelectronic and Semiconductor Packaging Alloy Solder Solutions
Fitech Provides Services for Customers Globally
Market Area
China
USA
India
Germany
Japan
South Korea