Description
FH-280 series is eutectic gold-tin solder paste with a melting point of 280℃. It is suitable for high-reliability packaging of semiconductors and microelectronic devices and high thermal-conductive packaging of high-power devices. The melting point of gold-tin solder paste is high. Therefore, FH-280 can be used to avoid melting and failure of solder joints in secondary reflow. It has been used in military, aerospace, medical, and other fields. FH-280 gold-tin solder paste has excellent thixotropy, suitable viscosity, outstanding wettability, and brilliant soldering performance. In addition, it has a high melting point, high tensile strength, excellent oxidation and corrosion resistance, extraordinary thermal conductivity, and superior electrical conductivity. It complies with RoHS standards. It exhibits stable performance under high-temperature operation.
Features
1. FH-280 is a type of solder paste with a high melting point and high tensile strength.
2. It has superior anti-oxidation and anti-corrosion performance, and it is compatible with other precious metals;
3. It has outstanding thixotropy, suitable viscosity, excellent wettability, high tensile strength and extraordinary soldering performance;
4. It has excellent thermal conductivity and electrical conductivity;
5. It is the priority choice in reflow soldering because of its high melting point;
6. It complies with RoHS standards.
