Solder Paste Solutions and Technical Support-Shenzhen Fitech

PRODUCTS
APPLICATIONS
MARKET AREA
TECHNICAL SUPPORT
NEWS
ABOUT US

ULTRA-FINE SOLDER PASTE

ULTRA-FINE EPOXY SOLDER PASTE

GOLD-TIN SOLDER PASTE

SOLDER PASTE FOR MULTIPLE REFLOW SOLDERING

LASER SOLDER PASTE

WATER-SOLUBLE SOLDER PASTE

JETTING SOLDER PASTE

FLUX

HIGH/LOW TEMPERATURE SOLDER PASTE

LEAD-FREE SOLDER PASTE

ULTRA-FINE SOLDER POWDER

LOW ALPHA SOLDER PASTE/SOLDER POWDER

SMT SOLDER POWDER

CUSTOMIZED PACKAGING SOLDER

Ultra-Fine Printing Solder Paste

Ultra-Fine Dispensing Solder Paste

Ultra-Fine Jetting Solder Paste

Ultra-Fine Pin-Transferred Solder Paste

Ultra-Fine No-Clean Solder Paste

Ultra-Fine Water-Soluble Solder Paste

Ultra-Fine Medium and High Temperature Solder Paste

Ultra-Fine Low-Temperature Solder Paste

T8 Ultra-Fine Solder Paste

T9 and T10 Ultra-Fine Solder Paste

Low-Temperature Ultra-Fine Epoxy Solder Paste

Medium and High Temperature Ultra-Fine Epoxy Solder Paste

Anisotropic Conductive Paste

Gold-Tin Solder Paste

High-Temperature Solder Paste for Multiple Reflow Soldering

Low-Temperature Lead-Free Solder Paste for Secondary Reflow Soldering

Water-Soluble Solder Paste for Laser Soldering

Water-Soluble Solder Paste

Jetting Solder Paste

Epoxy Flux

No-Clean Flux

Water-Soluble Flux

High-Temperature Lead-Free Solder Paste

SAC305 Series Solder Paste

Low-Temperature SnBiAg Solder Paste

Low-Temperature High-Reliability Solder Paste

High-Temperature Leaded Solder Paste

Low-Temperature Leaded Solder Paste

SAC305

SnBiAg Solder Paste/Epoxy Solder Paste

Low-Temperature High-Reliability Solder Paste/Epoxy Solder Paste

Lead-Free Silver-Free Solder Paste/Sn-Cu Solder Paste

High-Temperature Lead-Free Solder Paste

Gold-Tin Solder Paste

Ultra-Fine Solder Powder

Low-Alpha Solder Powder

Low-Alpha Solder Paste

SMT Solder Powder

MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING

INTEGRATED CIRCUIT PACKAGING

MEMS PACKAGING

POWER DEVICE PACKAGING

SAC305 Ultra-Fine Die Bond Solder Paste

Low-Temperature Ultra-Fine Die Bond Solder

High-Strength Ultra-Fine Die Bond Solder Paste

Fitech Anisotropic Conductive Adhesive (FACA)

Ultra-Fine-Pitch Flux

Flip-chip Die Bond Solder Paste

FPC Low-Temperature Epoxy Solder Adhesive

Low-Alpha High-Lead Solder

Lead-Free Silver-Free Solder for SiP

Water-Soluble Solder Paste for SiP

Low-Alpha Lead-Free Solder

Ultra-Fine-Pitch Flux

SAC305 Series Solder Paste

Low-Temperature Solder Paste for Component Mounting

Low-Temperature Epoxy Solder Paste for Component Mounting

MCU Packaging Solder

Gold-Tin Solder Paste for MEMS Packaging

Solder for MEMS Reflow Soldering

High-Reliability Low-Temperature Solder Paste

High-Reliability Low-Temperature Epoxy Solder Paste

Water-Soluble Laser Solder Paste

Low-Temperature Epoxy Solder Paste for Camera Modules

Au80Sn20 Gold-Tin Solder for Power Devices

High-Temperature Lead-Free Solder Paste for Power Devices

Water-Soluble Solder Paste for Power Devices

Conventional Solder for Power Devices

MINI/MICRO LED PACKAGING

AUTOMOTIVE ELECTRONICS

RAIL TRANSIT

5G

IOT & WEARABLES

3C PRODUCTS

MILITARY & AEROSPACE

MEDICAL EQUIPMENT

Low-Temperature Solder for Mini LED Die Bond

Medium-Temperature Solder for Mini LED Die Bond

High-Strength Low-Temperature Solder for Mini LED Die Bond

COB Flip-chip Packaging Solder

FPC Low-Temperature Packaging Solder

BGA Flux for Mini/Micro LED

PCBA Solder

Automotive Power Module Packaging Solder

In-Vehicle Infotainment Packaging Solder

Automotive LED Packaging Solder

Automotive MEMS Packaging Solder

MCU Packaging Solder for Automotive Electronics

Rail Transit IGBT Packaging

SiP Solder for Baseband Chips

High-Reliability Packaging of Memory Chips

RF Power Device Packaging

PCBA Packaging

Multiple Reflow Packaging

IoT Security Chips and Payment Chips SiP

IoT Identity Verification and MEMS SiP

RF Power Devices and Chips Packaging

PCBA Packaging

MCU Packaging

Camera Modules Packaging

No-Clean Solder Paste/ Solder Adhesive for 3C Products

High-Reliability Water-Soluble Solder Paste for 3C Products

High-Strength Low-Temperature Solder Paste/Epoxy Solder Adhesive

MCU Packaging Solder for 3C Products

High-Reliability High-Temperature Solder (Au80Sn20)

Low alpha High-Lead Solder for High-Reliability Packaging

Au80Sn20 Solder Paste

Medical Equipment SiP

Laser Solder for Complex Structures

Precision Structures Low-Temperature Packaging

MCU Packaging

Low-Temperature Solder for Mini LED Die Bond

TECHNICAL SUPPORT

Cases & Solutions Videos Sample Request Customer Service FAQ

Company News Alloy Properties Industry Information

Company Profile Corporate Culture Awards & Qualification R&D Center Careers Contact Us

vivi.kang@szfitech.com

(+86)18145850216

福英达

Technical Support

Home > Technical Support > Product Video

福英达

Solutions & Cases
Videos
sample application
customer service
FAQ

Products
Applications
Market Area
Technical Support
News
About Us

Copyright©2019 Shenzhen Fitech Co.,Ltd. All rights Reserved.

Shenzhen Fitech Co.,Ltd.

Tel ： 18126354772

Fax : 0755-26820233

Email : vivi.kang@szfitech.com

Products Applications Market Area Technical Support News About Us

CONTACT US

18126354772

Subscribe us on Wechat

Subscribe us on Wechat

Links ：清洗剂 China one stop gold factory G&T（GOLD&TIN）SOLDER

Copyright©2019 Shenzhen Fitech Co.,Ltd. All rights Reserved.

sitemap Statistics

We use cookies to understand how our audience uses our site.

Fitech websites use cookies to deliver and improve the website experience, See our cookie policy for further details on how we use cookies and how to change your cookie settingsCookie policy.

Accept

Reject