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福英达
福英达

ULTRA-FINE SOLDER PASTE

Ultra-fine solder paste

T6, T7, T8, T9, and T10 solder powder are called ultra-fine solder powder because of their small particle sizes. Solder paste consisting of T6 to T10 solder powders is called ultra-fine solder paste. With the continuous development of the microelectronics and semiconductor industry, the chip size is getting smaller while the packaging density is getting higher. It's hard to meet the requirements of microelectronics and semiconductor packaging with traditional solder paste products of T4 and above. Currently, the solder paste used in packaging is increasingly being "ultra micronized".

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ULTRA-FINE SOLDER PASTE

Jetting solder paste is a high-end product specifically suitable for jet printing. Jet printing is a non-stencil solder spray coating technology, which provides a new process method besides printing and dispensing. Specialized ejector structures spray solder paste at extremely high speeds over the substrate. Jet printing allows the ejector to remain contactless with the pad similar to inkjet printing. Jet printing technology can meet increasingly complex substrates and the highest quality requirements. Users can control the usage of solder paste required for each component's lead to optimize solder joint quality. Jet printing allows solder paste to distribute on the complex substrate with uneven structure and is suitable for the TFT process. 


T7 Jetting Solder Paste


FTJ-901
FTJ-305
FTJ-574
Product Display


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Product Display

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Product Display

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Our engineers will be happy to answer your questions or help you choose the right solder product