Jetting solder paste is a high-end product specifically suitable for jet printing. Jet printing is a non-stencil solder spray coating technology, which provides a new process method besides printing and dispensing. Specialized ejector structures spray solder paste at extremely high speeds over the substrate. Jet printing allows the ejector to remain contactless with the pad similar to inkjet printing. Jet printing technology can meet increasingly complex substrates and the highest quality requirements. Users can control the usage of solder paste required for each component's lead to optimize solder joint quality. Jet printing allows solder paste to distribute on the complex substrate with uneven structure and is suitable for the TFT process.
