CUSTOMIZED PACKAGING SOLDER

JETTING SOLDER PASTE

Jetting Solder Paste

The technology of accurately distributing the solder paste on the solder pads by jetting (spraying) through the solder paste printer is called solder paste jetting technology. The solder paste used is called jetting solder paste. The jetting solder paste is applied to the small batch production of camera modules, FPCs, thermal sensors, MEMS, and other components that are incompatible with the printing or dispensing process.

The jetting solder paste should have superior properties such as thixotropy, rheology, wettability, etc.

Jetting solder paste is a high-end solder paste especially suitable for the spray printing process. Jetting is a solder paste deposit method without using a stencil, which provides a new process method for solder paste printing and dispensing. The jetting machine sprays the solder paste at a very high speed on the substrate, which is contactless similar to the inkjet printer. Solder paste jetting can meet the increasing requirements of substrate complexity and the highest quality requirements. Users can control the solder paste capacity required for each component's lead to ensure the best solder joint quality. Jetting is suitable for the solder paste deposit of complex substrates with uneven structure and TFT process and can realize solder paste patterns such as point, line, and plane.

Products

Technical Data

Packaging Details

Instructions

Physical Properties

Features

FTJ-901

FTJ-305

FTJ-574

Process	Alloy Composition	Particle Size	Flux Type	Washing Method
Jetting	SAC305	T6 (5-15μm) T7 (2-11μm) T8 (2-8μm) T9 (1-5μm)	Halogen-Free (Cl+Br <1500ppm)	No Clean / Water-Based Cleaning


	Sn42Bi57.6Ag0.4	T6 (5-15μm) T7 (2-11μm) T8 (2-8μm) T9 (1-5μm)	Halogen-Free (Cl+Br <1500ppm)	No Clean / Water-Based Cleaning


	Sn90Sb10	T5 (15-25μm) T6 (5-15μm) T7 (2-11μm)	Halogen-Free (Cl+Br <1500ppm)	No Clean / Water-Based Cleaning

Technical Data of Jetting Solder Paste
Halogen Content	Halogen-Free / Zero Halogen (J-STD-004B)
Flux	ROL1
Slump Test	Pass (J-STD-005)
Wettability	Pass (J-STD-005)
Corrosion to Copper Plate	Pass (J-STD-004)
Drying Degree of Residue	Pass
Solder Ball Test	Pass (J-STD-005)
Silver Chromate Paper Test	Pass (J-STD-004)

Packaging Details

1. Packaging

Jetting type: The jetting solder pastes are stored in EFD syringes with the size of 10g/5cc and 30g/10cc.
The jettingsolder pastes can be packaged according to the customer's requirements.
The solder pastes are stored in ice bags, foam boxes, and cartons for transportation.

2. Transportation and storage

Transportation conditions: The solder pastes are stored in ice bags when delivering.

Storage conditions: Please put the solder pastes into the refrigerator for storage as soon as possible after receiving them.
The recommended storage temperature is 0~10℃. An excessively high temperature will shorten the service life and properties of the solder paste.

Instruction

1. Transfer method: Jetting;

2. Reflow soldering is recommended for curing;

3. Fitech can provide the users with reflow profiles for reference, which can be used to further discover the optimal reflow
profile;

4. The actual reflow profile should be considered regarding the product nature, framework size, chip distribution, and
characteristics, equipment process conditions, and other factors. It is advisable to do more tests in advance to ensure the
optimization of the reflow profile;

5. In addition to the "heating-soak" method, the solder paste with epoxy flux can also adopt the "progressive heating" method;

6. The optimum ambient temperature and humidity for solder paste application are 20-25℃ and 40-60RH%, respectively. The

solder paste must be reflowed with nitrogen protection. The oxygen concentration should be less than 1000 ppm.

Physical Properties of Jetting Solder Paste
Color	Light Gray
Alloy Melting Point	139℃, 219℃, 245℃
Alloy Component Ratio	85% (Typical Value)
Thixotropy Index	0.5
Viscosity	Low

Features of Jetting Solder Paste

A. Solder powder has good sphericity and narrow particle size distribution, ensuring the jetting smoothness of solder paste

without needle blockage;

B. Excellent thixotropy and rheology: To ensure the jetting smoothness of solder paste and to better control the jetting volume
of solder paste;

C. Moderate viscosity and outstanding wettability: it is beneficial to maintain the shape of solder paste points and eliminate

defects such as discontinuous solder release;

D In general, jetting solder paste is a flexible and convenient solder product, which is suitable for solder paste coating of
the complex substrate and TFT process and can realize solder paste patterns such as point, line, and plane.