ULTRA-FINE SOLDER PASTE
T6、T7、T8、T9、T10
“Type 6", "Type 7", "Type 8", "Type 9", "Type 10" solder paste / epoxy solder paste/ ACF.
T6、T7、T8、T9、T10
“Type 6", "Type 7", "Type 8", "Type 9", "Type 10" solder paste / epoxy solder paste/ ACF.
T6-T10
Solder adhesive, also known as epoxy solder paste, is widely used in SMT precision microelectronic component soldering, semiconductor packaging, chip packaging, LED die bond packaging, FPC flexible products, camera modules, and other fine soldering fields due to its unique advantages....
T4-T6
Gold-tin solder paste is one of the most reliable solder materials for microelectronics and semi-conductor, which can be used in military, aerospace, and medical equipment with reliable packaging.....
T4-T6
High-temperature lead-free secondary-reflow solder paste, low temperature lead-free secondary-reflow solder paste, and conventional SAC solder paste can be used for secondary reflow with different temperature scenarios. These products solve the problem of inconsistent reliability between the first and the second reflows...
T5-T7
Laser solder paste used for laser soldering is suitable for camera modules, FPC flexible circuit boards, thermal devices, MEMS, and other scenarios that must be locally heated and soldered...
T5-T9
Water-soluble solder paste (also known as water-wash solder paste) is a special type of solder paste used for electronic component soldering. Unlike other types of solder paste, water-soluble solder paste can be dissolved and washed away with pure water (deionized water).
T6-T9
Jet printing technology is defined as the precise distribution of solder paste on the pads in a non-contact manner by a solder paste jet printer...
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Fine-pitch flux assists in the manufacturing, assembly, and packaging of microelectronics and semiconductors. It is suitable for high precision and reliability packaging of wafer bumping soldering, chip evaporation soldering, BGA, SiP, CSP, Micro LED packaging, module integrated circuits, etc....
T4-T9
The compositions of alloy and flux in solder pastes are different, leading to different soldering temperatures. Therefore, Fitech divides solder paste products into different categories according to soldering temperatures, including high-temperature, medium-high temperature, medium-temperature, and low-temperature solder pastes...
T4-T9
Fitech produced lead-free solder paste under the idea of "lead-free electronics" which refers to the solder paste that the total concentration of toxic and harmful...
T6-T10
Ultra-fine solder powder refers to T6 to T10 solder powder based on alloy particle sizes. With the development of microelectronics and semiconductor packaging technology, electronic-grade packaging has been widely applied...
T3-T8
The low alpha solder series is a high lead solder developed by Fitech with a low alpha particle count for SiP, Flip Chip, and other high-density and miniaturized packages...
T2-T5
The ordinary SMT solder powder produced by Fitech covers various alloys such as tin-lead solder powder, tin-bismuth solder powder, lead-free and bismuth-free solder powder. SMT solder powder is adapted to high, medium and low soldering temperatures and a variety of processes such as printing, dispensing, jet printing and others. SMT solder powder has the advantages of excellent sphericity, narrow particle size distribution, low oxygen content and high chemical purity.
T2-T10
Fitech has a R&D team consisting of senior engineers, young scientists, masters, bachelors and other scientific researchers.
Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product
