CUSTOMIZED PACKAGING SOLDER

ULTRA-FINE SOLDER PASTE

Ultra-fine solder paste

T6, T7, T8, T9, and T10 solder powder are called ultra-fine solder powder because of their small particle sizes. Solder paste consisting of T6 to T10 solder powders is called ultra-fine solder paste. With the continuous development of the microelectronics and semiconductor industry, the chip size is getting smaller while the packaging density is getting higher. It's hard to meet the requirements of microelectronics and semiconductor packaging with traditional solder paste products of T4 and above. Currently, the solder paste used in packaging is increasingly being "ultra micronized".

Ultra-Fine Printing Solder Paste

Ultra-Fine Dispensing Solder Paste

Ultra-Fine Jetting Solder Paste

Ultra-Fine Pin-Transferred Solder Paste

Ultra-Fine No-Clean Solder Paste

Ultra-Fine Water-Soluble Solder Paste

Ultra-Fine Medium and High Temperature Solder Paste

Ultra-Fine Low-Temperature Solder Paste

T8 Ultra-Fine Solder Paste

T9 and T10 Ultra-Fine Solder Paste

Water-soluble solder paste can be cleaned with deionized water after soldering. Generally, it can be cleaned by soaking, spraying, ultrasonic, etc., and then rinsed with deionized water. Finally, the PCB drys naturally or with hot air. With the development of technology, packaging manufacturers require higher reliability of the solder joint: bright solder joints, no residue, higher electrical performance, and a more environmentally friendly process. The processes of water-soluble solder paste are the same as that of no-clean solder paste, but the operating environment of water-soluble solder paste is stricter. The stability of the water-soluble solder paste is a little worse than that of the no-clean solder paste.

FWS-305 Solder Paste Tests

FWS-305P

FWS-305L

Description

The main alloy of FWS-305P water-soluble solder paste is tin-silver-copper (SAC305). The water-soluble solder paste product is prepared by mixing T5, T6, T7, or T8 alloy powder with halogen-free environmental-protection flux.

Features

1. The alloy has excellent sphericity, uniform particle size, and low oxygen content;
2. Outstanding halogen-free flux is used;
3. It has superior adhesion performance before soldering;
4. The solder paste has excellent viscosity stability and superior stencil life;
6. It is an ideal solder with extraordinary water cleaning performance for high-reliability micro-bump ultra-fine-pitch packaging.

Properties

Before Curing：

FWS-305P Properties

After Curing:

FWS-305P Properties

Product Display

Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-55%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25 and 40℃.

Description

FWS-305L water-soluble laser solder paste is formulated with SAC305 solder powder and excellent halogen-free water-soluble flux. FWS-305L has superior adhesion performance before soldering, which can meet the laser soldering process requirement. In addition, the product has many advantages like excellent soldering effect, no spatter, and outstanding water solubility, which makes it suitable for high-reliability micro-bump ultra-fine-pitch packaging.

Properties

Before Curing：

FWS-305L Properties

After Curing:

FWS-305L Properties

Product Display

Instructions

Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.

Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.

Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.

Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.

Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25°C and 60°C .

Our engineers will be happy to answer your questions or help you choose the right solder product