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5G Packaging Solders

5G communication module provides high-speed, low-latency, and wide-coverage communication functions through 5G signals. It is applied in displays such as AR, VR, 8K high-definition video, unmanned driving, smart factories, remote meter reading, sharing economy, and environmental monitoring. Fitech provides customers in the field of 5G communication with high-reliability packaging materials and solutions of baseband chips, storage chips, RF chips, discrete devices, PCB boards, and other devices.