The lead-free silver-free solder series developed by Fitech handles the electromigration of conventional SAC solder due to the existence of silver. According to the different requirements of customers, Fitech provides T6-T9 solder products with alloy components such as SnCuX, SN100C, etc. In addition, the products include ultra-fine solder powder, no-clean solder paste, water-soluble solder paste, epoxy solder paste, etc. The lead-free silver-free solder series has many advantages, such as excellent powder sphericity, narrow particle size distribution, lead-free silver-free alloys, no silver migration, bright solder joints, and outstanding wettability.
