Flux_ Solder Paste_Ultra-fine Solder Paste Manufacturer-Shenzhen Fitech

SEMI-CONDUCTOR PACKAGING

ULTRA-FINE SOLDER SOLUTIONS

Hot key words ： Type 6/Type 7 Ultra-fine solder adhesive Solder Solutions Type 8 Type 9/Type 10

Market Area

Fitech provides high-quality products and services to the customer in the areas such as micro-electronic display, car electronics and so on.

MINI/MICRO LED PACKAGING

MINI/MICRO LED PACKAGING

AUTOMOTIVE ELECTRONICS

AUTOMOTIVE ELECTRONICS

RAIL TRANSIT

IOT & WEARABLES

IOT & WEARABLES

3C PRODUCTS

MILITARY & AEROSPACE

MILITARY & AEROSPACE

MEDICAL EQUIPMENT

MEDICAL EQUIPMENT

MINI/MICRO LED PACKAGING

MINI/MICRO LED PACKAGING

AUTOMOTIVE ELECTRONICS

AUTOMOTIVE ELECTRONICS

IOT & WEARABLES

IOT & WEARABLES

MILITARY & AEROSPACE

MILITARY & AEROSPACE

MEDICAL EQUIPMENT

MEDICAL EQUIPMENT

Fitech

has an advanced quality inspection and R&D center in Shenzhen which could also provide customers technical support.

Fitech is a national high-tech enterprise that mainly focuses on research and development , manufacturing, sales and solution provision of solder material. Fitech was found in Shekou in 1997, and now has the ability to manufacture T2-T9 solder powders for micro-electronic devices.

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Fitech is a national high-tech enterprise that mainly focuses on research and development , manufacturing, sales and solution provision of solder material. Fitech was found in Shekou in 1997, and now has the ability to manufacture T2-T9 solder powders for micro-electronic devices.

Learn more

10 +

T2-T10 All-Size Cases

20 years’

Experience in Solder Paste Development

20 +

Research Staff

40 +

Patents

56 +

Cooperative High Schools and Research Centers

News

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Fitech commit ourselves to providing professional and efficient service.

Shenzhen Fitech was invited to participate in 2024 Global CMOS Sensor Application Technology Summit

Shenzhen Fitech was invited to participate in 2024 Global CMOS Sensor Application Technology Summit

The Global CMOS Sensor Application Technology Summit was held in Huashi Grand Ballroom on the 3rd floor of Shenzhen Grand China Hilton Hotel, and Fitech brought the special tin glue and solder paste

Comparison of Surface Mount and Through-Hole Technologies_Shenzhen Fitech

Comparison of Surface Mount and Through-Hole Technologies_Shenzhen Fitech

The fundamental difference between SMT and THT is between "paste" and "insert". Surface Mount Technology (SMT) uses leadless or short-lead components that are mounted on the surfac

Videos

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Fitech commit ourselves to solving semi-conductor packaging problem.

SZ Fitech, a one-stop ultra-micro solder solution provider!

What are the functions of Solder Flux?

The Application of Ultra-Fine Solder Paste in SiP Micro Bump Presetting

How to Evaluate the Application Performance of Lead-Free Solder Alloys

How to Choose A Suitable Solder Paste Product according to the Process Temperature

Liquid Molding Technology for Ultra-Fine Solder

福英达超微焊料助力微间距焊接效率提升-2021深圳ELEXCON现场

Cooperators

Fitech provides global cooperators with solder solutions for semi-conductors packaging.