High-temperature lead-free solder paste for power devices is the solder paste with a minimum alloy melting point of 260°C., which is suitable for multiple reflow soldering of power semiconductor packaging and microelectronic packaging. It is synthesized based on bismuth elements by adding reinforced micro/nanoparticles, successfully replacing high-lead solder paste, and meeting RoHS environmental protection standards. Different solder powder particle sizes and metal contents can be provided to satisfy various customers’ requirements for products and processes.
