Mini/Micro LED generally refers to LED display technology with a chip size within 200/50um and a pixel pitch less than 1.0mm. With the continuous maturity of LED production and packaging technology, mini/micro LED display technology is developing rapidly. Mini/Micro LED display technology can be used in TVs, PCs, tablets, mobile phones, wearables, etc. As the application of advanced packaging technologies such as flip-chip continues to evolve, the packaging density of mini/micro LED significantly increases, while the pixel pitch is getting smaller and smaller. The complex packaging process poses a new challenge to solder. Fitech provides reliable solder and solution support for the mini/micro LED micro-photoelectric display industry.
Description
FSA-170 series epoxy solder paste is made of low-temperature alloy solder powder FL170 with excellent sphericity, uniform particle size, low oxygen content, and halogen-free flux. The solvent evaporates very slightly during soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effects of solder paste. FSA-170 is a no-clean product. Solder residue becomes thermosetting adhesive around the solder joints to improve soldering strength, corrosion resistance, and insulation. FSA-170 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.
Features
1. FSA-170 has excellent soldering strength with a peak reflow temperature of 170℃;
2. It is unnecessary to clean after soldering, and the residue becomes thermosetting adhesive to improve electric insulation and solder joint strength;
3. It has outstanding chemical activity and does not generate solder balls after soldering;
4. The operation is simple. Reflow oven, electric hot plate, and stove can be used;
5. It has advantages such as outstanding thixotropy, suitable viscosity, excellent stability, no delamination, and long operating life;
6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.
Description
FSA-574 series epoxy solder paste is formulated with SnBi series low-temperature ultra-fine solder powder with excellent sphericity, uniform particle size, and low oxygen content, and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and curing. There is no solder ball generation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which have soldering effects equivalent to that of solder paste. FSA-574 epoxy solder paste is unnecessary to clean after soldering. The solder residue becomes thermoset adhesive, which is attached around the solder joint to improve soldering strength, corrosion resistance, and insulation. FSA-574 is suitable for the reliable packaging of thin substrates and non-heat-resistance components.
Features
1. FSA-574 can achieve metallurgical connection and have better thermal conductivity and electrical conductivity than that of silver conductive paste;
2. It does not require washing after soldering, and the residue becomes thermosetting adhesive to promote electrical insulation;
3. It has excellent chemical activity and solder ball elimination performance;
4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;
5. It has advantages of excellent thixotropy, appropriate viscosity, outstanding stability, no delamination, and long stencil life;
6. It has the functions of self-assembly and chip correction. When applying epoxy solder paste, the chip is automatically corrected when heating, and the solder automatically combines with the pad.
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