FACA-138D series is a low-temperature metallurgical-bonding halogen-free anisotropic conductive paste (ACP). The main alloy component of FACA-138D is SnBiAg0.4. Fitech classifies solder powders into T8 powder (2-8um), T9 powder (1-5um), and T10 powder (1-3um) based on particle sizes. Solder powder and epoxy-based flux are combined to produce a low-temperature conductive paste.
1. The conductive filler has uniform particle size, and FACA-138D has outstanding dispersion performance;
2. After hot-pressing solidification, the bonding of insulated materials increases soldering reliability;
3. There is no solvent volatilization during the hot-pressing curing process;
4. The hot-pressing temperature is low, and the solder powder melts and metallurgically connects with the pad, enhancing the bonding strength;
5. FACA-138D is an extraordinary anisotropic conductive solder that is longitudinal conductive and non-conductive in the transverse direction.
Before Curing:
1. Warming Instruction: Solder paste needs to be refrigerated, and the preferred temperature is 0-10℃. When taking out solder paste from the cold box, its temperature is much lower than the room temperature. If the bottle cap opens without rewarming, the water vapor in the air will easily condense and adhere to the solder paste. The high temperature exceeding 150℃ during soldering increases the vaporization rate of water, which may cause the phenomenon of "exploding solder" to produce solder balls and even damage the components.
2. Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
3. Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
4. Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heat sources.
5. Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively.
