The compositions of alloy and flux in solder pastes are different, leading to different soldering temperatures. Therefore, Fitech divides solder paste products into different categories according to soldering temperatures, including high-temperature, medium-high temperature, medium-temperature, and low-temperature solder pastes. Solder paste with high soldering temperature tends to have better soldering strength. It is suitable for the soldering processes that require high soldering strength. It is also applicable for the first reflow of secondary-reflow soldering. Differ from high-temperature solder paste, low-temperature solder paste tends to protect circuit boards and is suitable for temperature-sensitive circuit boards and devices. Low-temperature solder paste is used in the second reflow of secondary-reflow soldering.
The high-quality FTD-637 dispensing solder paste is produced by mixing Sn63Pb37 solder powder with excellent sphericity, uniform particle size, and low oxygen content with outstanding halogen-free flux. The solder paste has a superior tackiness effect before soldering and less solvent volatilization during soldering. Moreover, the solder paste has excellent wettability, anti-slump, and residue reduction properties. FTD-637 is suitable for micro-bump ultra-fine-pitch soldering.
1. Adapting solder powder formulation with high sphericity and narrow particle size distribution, which contributes to stable solder paste release and anti-slump performance;
2. It has outstanding chemical activity, satellite solder ball elimination performance, and excellent wettability;
3. The operation is simple. Reflow furnaces, electric heating plates, ovens, and other heating devices can be used;
4. Good thixotropy, proper viscosity, superior stability, no stratification, and long working life.
Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
Warming Time: Return to warm for 2 to 4 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
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