MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING

Mini/Micro LED generally refers to LED display technology with a chip size within 200/50um and a pixel pitch less than 1.0mm. With the continuous maturity of LED production and packaging technology, mini/micro LED display technology is developing rapidly. Mini/Micro LED display technology can be used in TVs, PCs, tablets, mobile phones, wearables, etc. As the application of advanced packaging technologies such as flip-chip continues to evolve, the packaging density of mini/micro LED significantly increases, while the pixel pitch is getting smaller and smaller. The complex packaging process poses a new challenge to solder. Fitech provides reliable solder and solution support for the mini/micro LED micro-photoelectric display industry.

SAC305 Ultra-Fine Die Bond Solder Paste

Low-Temperature Ultra-Fine Die Bond Solder

High-Strength Ultra-Fine Die Bond Solder Paste

Fitech Anisotropic Conductive Adhesive (FACA)

Ultra-Fine-Pitch Flux

Flip-chip Die Bond Solder Paste

FPC Low-Temperature Epoxy Solder Adhesive

1. Product: Lead-free solder paste;

2. Flux: No-clean rosin resin, water-washable rosin resin, and water-based washing rosin resin;

3. Applications: Mini LED medium-temperature packaging and secondary reflow soldering with alloy melting temperatures of 217℃ to 219℃;

4. Type: T6(particle size: 5-15μm)-T9 (particle size: 1-5μm);

5. Advantages: Wide application, mature technology, various products available, high reliability, and small particle sizes;

6. Disadvantages: Higher reflow temperature than that of Sn63Pb37 eutectic solder;

7. Processes: Printing, dispensing, needle transfer, and jet printing;

8. Reflow under nitrogen protection (reflow oxygen content ≤100ppm).

Related Products

FWS-305L

FWS-305

FT-305

Description
FWS-305L series solder paste is formulated with SAC305 solder powder and excellent halogen-free water-soluble flux. FWS-305L has outstanding adhesion performance before soldering. It applies to the laser soldering process and has many advantages, such as superior soldering effect, no spatters, and excellent water solubility. FWS-305L is ideal for high-reliability micro-bump ultra-fine-pitch packaging.

Features

1. FWS-305L is suitable for rapid laser soldering and can eliminate spatter during soldering;

2. It has outstanding thixotropy and appropriate viscosity and can be used for jet printing, pin transfer, dispensing, printing, etc.;

3. It has excellent chemical activity and wettability;

4. It has outstanding water solubility;

5. It complies with RoHS and halogen-free environmental protection specifications.

Features

Product features and advantages:

产品特点及优势：

Product characteristics and advantages:

产品特点及优势：

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1. Excellent water cleaning performance to reach high soldering reliability;

2. Outstanding wettability;

3. Suitable for the packaging of micro-bump and ultra-fine-pitch component, providing extraordinary printing performance;

4. Extraordinary slump resistance;

5. Applicable to jet printing, pin transfer, dispensing, and printing with outstanding thixotropy and suitable viscosity;

6. Superior wettability and chemical activity;

7. Comply with RoHS and halogen-free environmental protection specifications.

FWS-305 Solder Joints.

Description
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305/FTD-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, the solder paste has extraordinary wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. It is an ideal soldering material for micro-bump ultra-fine-pitch packaging.

Features

1. FTP-305/FTD-305 has better thermal conductivity and electrical conductivity than that of silver conductive adhesive;

2. The ultra-fine solder powder has narrow size distribution. FTP-305/FTD-305 has stable solder paste printing and outstanding anti-slump performance, and it is suitable for ultra-fine-pitch packaging;

3. It has excellent chemical activity, solder ball elimination, and wettability;

4. The operation is simple. Equipment such as reflow ovens, electric hot plates, and stoves can be used;

5. It has excellent viscosity, outstanding stability, no delamination, and long stencil life.

Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product

ULTRA-FINE SOLDER PASTE

ULTRA-FINE EPOXY SOLDER PASTE

GOLD-TIN SOLDER PASTE

SOLDER PASTE FOR MULTIPLE REFLOW SOLDERING

LASER SOLDER PASTE

WATER-SOLUBLE SOLDER PASTE

JETTING SOLDER PASTE

FLUX

HIGH/LOW TEMPERATURE SOLDER PASTE

LEAD-FREE SOLDER PASTE

ULTRA-FINE SOLDER POWDER

LOW ALPHA SOLDER PASTE/SOLDER POWDER

SMT SOLDER POWDER

CUSTOMIZED PACKAGING SOLDER