1. Product: Lead-free solder paste;
2. Flux: No-clean rosin resin, water-washable rosin resin, and water-based washing rosin resin;
3. Applications: Mini LED medium-temperature packaging and secondary reflow soldering with alloy melting temperatures of 217℃ to 219℃;
4. Type: T6(particle size: 5-15μm)-T9 (particle size: 1-5μm);
5. Advantages: Wide application, mature technology, various products available, high reliability, and small particle sizes;
6. Disadvantages: Higher reflow temperature than that of Sn63Pb37 eutectic solder;
7. Processes: Printing, dispensing, needle transfer, and jet printing;
8. Reflow under nitrogen protection (reflow oxygen content ≤100ppm).