Integrated circuit packaging provides mechanical and electrical connections for IC chips. It also supplies physical protection. As a result, the integrated circuit chips have a stable and reliable operating condition. With the packaging development, manufacturers have adopted various advanced packaging technologies such as system-in-package (SiP) and system-on-chip (SoC), followed by a series of new challenges for packaging materials such as chip miniaturization, yield improvement, and cost reduction. Fitech provides reliable solder and solution support for integrated circuit packaging in various fields.
Fitech’s water-soluble solder paste is formulated with SAC305 solder powder and excellent halogen-free flux. The water-soluble solder paste has outstanding adhesion performance before soldering. In addition, it has many advantages, such as stable viscosity, long operating time, extraordinary soldering effect, and excellent water washing performance, which makes it ideal for high-reliability micro-bump fine-pitch packaging.
Features
1. Excellent water cleaning performance to reach high soldering reliability;
2. Outstanding wettability;
3. Suitable for the packaging of micro-bump and ultra-fine-pitch component, providing extraordinary printing performance;
4. Extraordinary slump resistance;
5. Applicable to jet printing, pin transfer, dispensing, and printing with outstanding thixotropy and suitable viscosity;
6. Superior wettability and chemical activity;
7. Comply with RoHS and halogen-free environmental protection specifications.
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