The lead-free and silver-free solder series developed by Fitech aims to solve the electromigration of conventional SAC solder due to the existence of silver. According to the different requirements of customers, Fitech provides T6-T9 solder products with alloy components such as SnCuX, SN100C, etc. In addition, the products include ultra-fine solder powder, no-clean solder paste, water-soluble solder paste, epoxy solder paste, etc. The lead-free silver-free solder series has excellent powder sphericity, narrow particle size distribution, lead-free silver-free alloys, no silver migration, bright solder joints, and outstanding wettability.
