Sitemap
page
news
Fitech’s Ultra-Fine Solder Paste Improves Ultra-Fine-Pitch Soldering Efficiency The "White Paper on Ultra-Fine-pitch LED Display Research" Co-Edited by Fitech was Released What are the Components of Low-Temperature Lead-Free Solder Paste? What are the Factors Influencing Solder Paste Printing-Part 1 What are the Factors Influencing Solder Paste Printing-Part2 Why are Polybrominated Biphenyls and Polybrominated Diphenyl Ethers Exceeding the Standard in Flux Components? Types of Void Defects in Microelectronic Packaging Solder Joints Formation and Harms of Kirkendall Voids in Solder Joints The Role of Solder Alloys and the Physical Properties of Solder Paste before Curing High-Temperature solder on Flip Chips and Low-Temperature Solder Paste on Laminate Substrates What Kind of Solder Paste is Selected for Flip Chip Package? How to Choose and Measure the Right Solder Paste Powder Size for Microchip Packaging? Selection of Solder Paste Solder for Ultra-Fine-Pitch mLED Display Packaging Ultra-Fine-Pitch LED Display Chip Structure and Selection of Lead-Free Solder Paste for Flip-Chip LEDs How to Classify Lead-Free Solder Pastes and Achieve Lead-Free Soldering? The Interfacial Reaction between SnPb Solder and Cu Substrate during Soldering Ultra-Fine Epoxy Solder Paste for CMOS - Shenzhen Fitech The Introduction of SAC305 Ultra-Fine-Pitch Die Bond Solder Paste Low-Temperature Die Bond Solder Paste for Flip-Chip Mini-LEDs Mini LED Packaging (SMD, IMD, COB, Wire Bonding, Flip-Chip) The Mainstream Lead-Free Soldering Practices Achieving High Reliability Lead-Free Solder Joints through Surface Finishes Mr. Xu Pu was invited by SBSTC to participate in the Mini/Micro LED Manufacturing Technology Seminar Ultra-Fine Solder Paste Assists in Mini/Micro LED Display Development The Mechanical Property Consideration to Achieve High-Reliability Lead-Free Solder Joints U.S. Invention Patent Authorization: "Reinforced Micro/Nanoparticle Composite Solder and Its Preparation Method" Developed by Fitech Solder Paste Micro-Bump Geometric Shape Influences of Transfer Efficiency and Reflow Profile on Printing Solder Paste The Properties of Electroplated Eutectic SnBi Solder Paste Bumps Introduction of Electromigration of Lead-Free Solder Paste Shenzhen Fitech Knowledge: Solder Paste Temperature Properties What is Reflow Profiles of Solder Pastes Why Should We Concern the Temperature Effects on Solder Paste Flux Sichuan Luding M6.8 Earthquake - Talking about the Reliability of Electronic Components What Role does Solder Paste Viscosity Play in Packaging How to Choose a Solder Paste according to Temperature Requirements? What are the Characteristics of No-Clean Flux_Shenzhen Fitech What are the Competitiveness of Anisotropic Conductive Adhesive (ACA)? The Basic Knowledge of Lead-Free Solder Paste (1)_Shenzhen Fitech The Basic Knowledge of Lead-Free Solder Paste (2)_Shenzhen Fitech The Basic Knowledge of Lead-Free Solder Paste (3)_Shenzhen Fitech The Basic Knowledge of Lead-Free Solder Paste (4)_Shenzhen Fitech The Basic Knowledge of Lead-Free Solder Paste (5)_Shenzhen Fitech Characteristics of Solder Paste: The Relationship between Solder Residue and Humidity Medium-Temperature Solder_ Thermal Fracture Failure Mechanism of BGA Solder Joints Lead-Free Solder Paste_ Metallurgical Bonding of Semiconductor and Solder Paste Epoxy Solder Paste_ Solder for Automobile Electronic Packaging Through-Hole Component Introduction_Fitech’s Solder Paste Introduction of Through-Hole Reflow Soldering Microstructure Evolution of Eutectic Gold-Tin Solder Joints- Shenzhen Fitech Introduction of Single Chip Packaging (SCP) - Fitech Solder Paste Fitech’s Solder Pastes for Automotive Electronic: Wire Bonding Reliability of Automotive MEMS Sensors Hybrid Integrated Circuit Packaging_ Fitech's Solder Paste Through-Hole Devices: Influences of Pad and Plated-Hole Dimensions SMT Solder Paste Printing Process - Automatic Solder Paste Feeding BGA Solder Paste and BGA Reballing Processes - Shenzhen Fitech Copper Pillar Bump Solder Paste _Copper Pillar Bump Reliability Printing Solder Paste_ PCBA Failure Caused by Chemical Corrosion Reliability of RFID Anisotropic Conductive Pastes_Shenzhen Fitech Soldering Reliability of PCB with Immersion Silver Surface Finish_Fitech Solder Paste Mechanical Strength of BGA Solder Joint at Low Temperature-Fitech Solder Paste PCB Copper Pad Corrosion Caused by Solders - Fitech Solder Paste Tin Whisker Issue for SnAgCu Solder Paste_Shenzhen Fitech Component Solderabilty_ Wetting Balance Test_Shenzhen Fitech PCB Hot Air Solder Leveling Process Introduction_Shenzhen Fitech Preparation of Bumps at Formic Acid Atmosphere without Flux_Fitech Solder Paste The effect of flux type on the spatter during soldering of solder paste - Fitech Solder Paste Relationship between IGBT Heat Conduction and Solder Voids_Shenzhen Fitech The Solder Joint Void Caused by Electroplating Impurity_Shenzhen Fitech Pad surface treatment in microelectronics and semiconductor packaging-Shenzhen Fitech Conventional tin powder production process - Centrifugal Atomization Method - Shenzhen Fitech Effect of adding Cu6Sn5 nanoparticles on the structure and properties of SnBi brazing alloys-Shenzhen Fitech Geographical distribution and application of composition studies of solder alloys-Shenzhen Fitech Application of Conductive Paste in Electronic Textiles_Shenzhen Fitech PCB surface treatment - Introduction to the OSP process-Shenzhen Fitech Failure Modes of Flip-Chip LED Solder Joints on Different Surface Finishes_Shenzhen Fitech Different Anisotropic Conductive Adhesive(ACA) on UHF RFID tag reliability impact-Shenzhen Fitech Ultrasonic-Assisted Bonding in Si/Cu Solder Joint _Shenzhen Fitech BGA solder joint failure analysis - Cold Soldering and Grape Ball Effect-Shenzhen Fitech Classification and selection of wave soldering flux-Fitech Flux Nucleation and Growth of Ag3Sn in Lead-Free Solders_Shenzhen Fitech Analysis of the causes of solder paste activity failure-Shenzhen Fitech Device failure due to SMT wick effect-Shenzhen Fitech BGA mixing process misconception - incomplete lead phase diffusion-Shenzhen Fitech Solder Paste for Mini LED Package-Fitech Solder Paste Thermal Gradient Bonding of Solder Paste_Shenzhen Fitech Characteristics and Types of Water-Soluble Flux-Shenzhen Fitech Thermomigration of Solder Joints _Shenzhen Fitech Shenzhen Fitech won the title of national SDRI(Specialized, Refinement, Differential, Innovation) "small giant" enterprise The Effect of Metal Segregation on the Reliability of Welded Joints_Shenzhen Fitech Gold Embrittlement in BGA Solder Joints-Shenzhen Fitech The Effect of Operating Temperature on Au-Sn Solder Joints_Shenzhen Fitech Non-wetting and De-wetting during Soldering_Fitech Solder Paste Effect of Cu Content in SnAgCu Solder on Warpage_Fitech Solder Paste The Effect of Ultrasonic Treatment on SAC305 Solder Joint_Shenzhen Fitech Influence of Nitrogen and Vapour Phase Soldering on the Formation of Tombstone Effect_Fitech Solder Paste μBGA, CSP in the Reflow Soldering of the Reasons for the High Rate of Cold Soldering_Shenzhen Fitech Soldering Performance of Epoxy Sn42Bi58 Solder Paste_Shenzhen Fitech Grape Ball Effect Causes the Effective Life of Solder Paste after Printing_Shenzhen Fitech The effect of via in pad on voids_Shenzhen Fitech Pin Device Desoldering Causes and Countermeasures_Shenzhen Fitech Effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints_Shenzhen Fitech Evolution of SAC305 under Electromigration and Thermal Shock_Shenzhen Fitech Epoxy Flux on POP Laminated Packages_Shenzhen Fitech The effect of adding Cr on the performance of SnBi low-temperature solder alloy-Shenzhen Fitech Reduce Soft Error Rate of Microelectronic Packaging with Low Alpha Particle Solder Paste_Shenzhen Fitech How to improve the mechanical reliability of SAC solder paste_Shenzhen Fitech Introduction to PCB Creeping Corrosion_Shenzhen Fitech T8~T10 Ultra-Fine Solder Powder Helps Micro-Gap Chip Packaging_Shenzhen Fitech Application of Laser Solder Ball Soldering Process in Microelectromechanical Products_Shenzhen Fitech Improving Flip Chip Packaging Efficiency and Reliability with Epoxy Flux_Shenzhen Fitech Improve Package Reliability and Efficiency with Low- Temperature SnBi Epoxy Solder Paste_Shenzhen Fitech The Prospect of SAC305 Nano-Solder Paste and Microwave Hybrid Heating_Shenzhen Fitech PCBA Conformal Coating Process Corrosion Failure Analysis_Shenzhen Fitech Underfill Process on Flip Chips_Shenzhen Fitech The Effect of Ag Content on the Reliability of SnBi Solder LED Package_Shenzhen Fitech Seize the day and live it to the fullest | Fitech 2023 Year End Review Application of Gold-Tin Solder on Power LED Devices_Shenzhen Fitech Creep Performance for Solder Joint Reliability_Shenzhen Fitech The Impacts of Laser and Reflow Soldering on Solder Joints_Shenzhen Fitech Advantages of Solder Paste Containing Bismuth compared to SAC305 Solder Paste_Shenzhen Fitech Influence of Copper Nanoparticles on Solderability and Microstructure of SnBi Solders_Shenzhen Fitech Shenzhen Fitech was invited to participate in 2024 Global CMOS Sensor Application Technology Summit
Ultra-Fine Solder Paste Debut_Mini/Micro LED New Display Application Conference opened in Bao‘an District, Shenzhen How to Reduce the Formation of Solder Balls-Solder Paste Selection What is Solder Paste? What are the Functions, Compositions, and Properties of Solder Paste? What are the Requirements for Lead-Free Solder Pastes from an Industrial Application Point of View? Composition and Requirements of Solder Paste Flux Types and Functions of Solder Paste Flux Carriers The Role of the Combination of Matrix Material and Active Agent in Lead-Free Solder Paste Flux during Reflow Soldering Types, Functions and Mechanisms of Active Substances in Solder Paste Fluxes Mechanism of Oxide Film Removal by Active Substances of Solder Paste Flux The Roles and Selection of Adhesive and Solvent in Solder Flux How to Choose a Suitable Solder Paste? How to Choose a Solder Paste Manufacturer? What Characteristics Should be Paid Attention to when Choosing a Solder Paste? What does the Thixotropy Mean for Solder Paste Printing? Effects of Composition and Properties of Solder Paste on Applications How to Evaluate the Comprehensive Performance of the Selected Solder Paste? What Problems Should be Concerned about when Choosing a Solder Paste? Lead-Free Solder Paste for MEMS Devices: Low Stress Packaging of MEMS Devices Low-Temperature Ultra-Fine-Pitch Solder Paste for mLED: Tesla Light technology Decryption Solder Paste for Flip Chip: Expansion of Micro LED Consumption Solder Paste for MEMS Package: Atomic Layer Deposition Process Assists PowderMEMS Solder Paste for SiP: Scales and Dimensions of Integration Solder Paste for IGBTs: Power Cycle Test and Control Strategy for IGBTs Solder Paste for Mini-LEDs: Vehicle Display Screens Prefer to Mini/Micro LED Ultra-Fine-Pitch Solder Paste for Mini-LEDs：Mini-LEDs Enter Golden Period of Development Lead-Free Silver-Free Solder Paste Solution for Silver Migration Automotive Camera Packaging Solder Paste：360-Degree View Camera is a Breakthrough in CIS Market Packaging Solder Paste: Global Lighting COB Packaging Vendor Revenue Ranking in 2021 Packaging Solder Paste: ASML’s Forecast of the Semiconductor Industry CMOS Packaging Solder Paste: The Competition of CMOS Sensors for Lidars Lead-Free Solder Paste for IC Circuits: Three Development Routes of IC Circuits T8 Lead-Free Solder Paste for MEMS Package：STMicroelectronics' 500,000 Megapixel 3D ToF Sensor T8 Solder Paste for MCU Package：Local MCU Market Development Direction Solder Paste for Automotive Grade Package: Five Trends of Automotive Technologies in 2022 Solder Paste for 5G Packaging: 5G Development Analysis Anisotropic Conductive Adhesive for Mini-LED Displays：LED Chip Industry Cyclicality Lead-Free Solder Paste: MEMS Nano-Wire Sensor Platform to Measure Flow and Temperature FPC Packaging Solder Paste：Reliability of Aluminium Bond Wires MEMS Packaging Solder Paste：The Combination of Flexible Sensors and Clothing Ultra-Fine-Pitch Solder Paste for FPC: Can FPC Manufacturers Find New Opportinities in the New-Energy Vehicle Market Dispensing Solder Paste: Core Components of PWS Earphones and Dispensing Process Packaging Solder Paste：Is Russian Afraid of Western Chip Sanctions? MEMS Application Trend and Market Status in China Solder Paste Selection for Laser Chip Placement and Packaging - Tin-Base, Indium-Base, and Gold-Base Solders The Application of Ultra-Fine Solder Pastes in New Display Mini-LED Automotive Applications and Autonomous Driving Sensors The Introduction of IoT The Development Trends of Ultra-Fine-Pitch LED Driver ICs The Trends and Requirements of PCBs for Ultra-Fine-Pitch LED Display The Quantum Dot Color Conversion Properties Based on Micro-LED Lighting The Introduction of Ultra-Fine Printing Solder Paste The Introduction of Dispensing Solder Paste Low-Temperature and Medium-Temperature Solders for Mini LED Packaging RFID Tag Packaging Solder - FACA Anisotropic Conductive Paste The Introduction of MEMS Packaging MEMS Packaging Solder Selection MEMS Laser Soldering The Applications of 5G and Its Packaging Process The Solder Paste Printing Process The Causes and Solutions of Pseudo Soldering The Application of Dispensing Process The Lead-Free Solder IMC Growth Mechanism and Impacts The Introduction of Eutectic and Eutectic Solder Pastes The Mechanism of Intermetallic Compounds of Tin-Bismuth Solder Paste What Is Black Pad? The Failure Modes of Solder Joints (1) The Failure Modes of Solder Joints (2) The Failure Modes of Solder Joints (3) The Failure Modes of Solder Joints (4) The Failure Modes of Solder Joints (5) Why Should We Care about Solder Paste Thixotropy? Effects of Sn Nano-Particle on Lead-Free Solder Paste Solder Paste Creep and Nano-Enhanced Method Wall-Slip Effect of Lead-Free Solder Paste Features and Advantages of Halogen-Free Lead-Free Solder Paste Electromigration Influences of Lead-Free Solder Paste on Solder Joint Reliability The Thermal Annealing Impacts on SnAgCu Solder Paste The Effects of Solder Paste Alloy Proportion on Bumps Shenzhen Fitech Knowledge-Solder Paste Alloy Composition What are the Functions of Solder FLux What are the Characteristics of Epoxy Solder Paste/Adhesive? What are the Particle Sizes of Solder Paste Alloys What Should We Know about Solder Paste Wettability? Lead-Free Solder Paste Composition: How Are Alloy Solder Powders Made? What are the Characteristics of Water-Soluble Solder Paste_Solder Paste Cleaning The Influences of Lead-Free Solder Voids on Flip-Chip LEDs How to Optimize the Reflow Time of Medium-Temperature Lead-Free Solder Paste Characteristics of No-Clean Solder Paste (1): Analysis of Corrosive Mechanism of Residues Characteristics of No-Clean Solder Paste (2): Analysis of Corrosive Mechanism of Residues Lead-Free Solder Paste_ Effects of PCB Nickel Plating on Soldering Solder Paste Introduction: Influence of Solder Layer Thickness on Cu3Sn Phase Medium-Temperature Solder Application_ Reflow Process Optimization for Fan-out Packaging Mini-LED Fan-out Panel-Level Packaging Solder Paste Test Printing Solder Paste_ Electroforming Process for Stencil Manufacturing Surface Mount Component Introduction_Shenzhen Fitech SMT Component Placement _Fitech‘s SMD Solder Paste Comparison of Mini/Micro LED, OLED and LCD_ Mini-LED Solder Paste Types of Chip Scale Package (CSP) - Fitech Solder Paste Laser Soldering Reliability - Fitech’s Laser Solder Paste Effect of Solder Paste Particle Size Distribution on Roll-Offset Printing The Squeegee System of Solder Paste Printing Process - Shenzhen Fitech Insufficient Volume Problem of Printing Solder Paste - Shenzhen Fitech Preparation and Common Problems of ENIG PCB-Shenzhen Fitech BGA Solder Paste_The Effect of Solder Joint Height on Solid-Liquid Diffusion Gold Embrittlement of Solder Paste_ Shenzhen Fitech Introduction to Solder Paste High-Temperature Reliability Test - Shenzhen Fitech Solder Joint Reliability with Different Reflow Number - Shenzhen Fitech High-Temperature Gold-Tin Solder Bump Fabrication and Reliability_Shenzhen Fitech Tin Whisker Growth of SAC305 Solder Paste in Corrosive Environment_Shenzhen Fitech Automotive LED Application and Packaging - Fitech Solder Paste Void Caused by Solder Paste Properties and Improper Reflow_Fitech solder Paste Introduction to Package on Package (PoP) and Pad Printing_Fitech Solder Paste Effect of ENIG Au Layer Thickness on SAC305 Soldering - Shenzhen Fitech Reliability assessment of ultra-thin 3D-IC packages under the influence of coupled loads from manufacturing process and temperature cycling tests-Shenzhen Fitech The selection of solder paste viscosity in the stabbing process of Mini LED backlight chips-Shenzhen Fitech Improvement of aging and electromigration mechanical properties of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads by adding nano-reinforced tungsten (W)-Shenzhen Fitech Selection of alloy composition for leadedand lead-free solder pastes - Shenzhen Fitech Fatigue Life Model of Solder Joint_Shenzhen Fitech The effect of pin coplanarity on soldering of electronic components-Fitech Solder Paste Highly Accelerated Life Test for reliability assessment of solder joints-Shenzhen Fitech Introduction to the PCB Immersion Deposition Tin-Shenzhen Fitech Ag-Decorated Multi-Walled Carbon Nanotubes Improvement for LED Package- Shenzhen Fitech The Impacts of Voids on LED Package_Shenzhen Fitech Common PCB solderability inspection methods-Shenzhen Fitech LGA device soldering failure analysisand countermeasures-Fitech Solder Paste Common PCBA cleaning solution-Shenzhen Fitech Optimizing Solder Paste Shape to Improve Resistor Fatigue Life_Shenzhen Fitech Nano-Additives Reduces Tin Whiskers in Solder Pastes_Shenzhen Fitech Reliability of BGA solder joints under mechanical and thermal stresses-Shenzhen Fitech PCB Surface Treatment Composite Process - Immersion Gold + OSP Effect of Oxidation Rate of Tin Powder in Solder Paste on Cold Soldering-Fitech Solder Paste Abnormal Growth and Cracking of IMC in ENIG Electroless Nickel-gold Plating-Shenzhen Fitech Fitech Ultra-Fine Solder Paste: Performance Material Innovation for New Mini/Micro LED Display Reflow Soldering with Nitrogen Protection-Shenzhen Fitech Soldering Performance of SAC305 Solder Paste on Different Cu Substrates_Shenzhen Fitech Causes and mitigation measures of voids during soldering_Shenzhen Fitech Void Caused by the Inherent Characteristics of Solder Paste Flux_Shenzhen Fitech Mechanism of Intermetallic Compound Formation-Shenzhen Fitech Application of Micro-Sized Cu in Power Devices_Shenzhen Fitech Wave Soldering Solder Pull Tip is How to Form_Sheznzhen Fitech Solder Paste Commonly Used for Solder Heating_Fitech Solder Paste Factors Affecting Flux Spatter_Shenzhen Fitech Pillow-Head Effect in BGA and CSP Package_Fitech Solder Paste PCB Solderability Test:_Tin Printing Experiment_Shenzhen Fitech Soldering Performance of Epoxy SAC305 Solder Paste_Shenzhen Fitech How to Avoid the Problem of Dropping Parts of the Second Reflow When Double-Sided Mounting? _Shenzhen FItech Impact of Solder Paste Printing on Reflow Soldering Success Rate_Shenzhen Fitech Addition of Silver Nanoparticles Improves Wettability of SnAgCu Solder Pastes_Shenzhen Fitech Is Cleaning Necessary When Using No-Clean Flux?_Shenzhen Fitech Improvement of Sn-Bi Low-Temperature Solder Paste by Adding Ag and In_Shenzhen Fitech Lead-Free Solder BGA Fatigue Performance _Shenzhen Fitech Mechanism of P segregation at the weld interface of ENIG Ni(P) coatings_Shenzhen Fitech Introduction to solder paste corrosion testing_Shenzhen Fitech The Parameters Affecting Centrifugal Atomized Solder Powder_Shenzhen Fitech Introduction to FCCSP Flip Chip Packaging Process_Shenzhen Fitech The effects of SAC305-SiC composite solder on intermetallic compounds_Shenzhen Fitech The Wettability of SAC305 Solder with SiC Doping_Shenzhen Fitech Solder Paste Jetting Process Introduction_Shenzhen Fitech Effect of Flux Residues on Corrosion of Electronic Devices_Shenzhen Fitech The Effects of Cu@Ag Core-Shell Particles on SnBi Solder_Shenzhen Fitech Ultrasonic Atomization Method for Manufacturing Solder Powder_Shenzhen Fitech Physical Properties and Reliability of Various Alloy Components of Solder Paste_Shenzhen Fitech The mechanical strength of high-temperature gold-germanium solder_Shenzhen Fitech Current Status of High-Lead Solder Use and Alternatives_Shenzhen Fitech How Low-Temperature Epoxy Solder Joint Is Affected by Residues-Shenzhen Fitech The Evolution of Intermetallic Compounds during Laser Soldering_Shenzhen Fitech Relationship between Laser Soldering Reflectivity and Solder_Shenzhen Fitech Corrosion Effects of Salt Spray on SAC305 Solder_Shenzhen Fitech Comparison of Surface Mount and Through-Hole Technologies_Shenzhen Fitech
Solder paste product
Solder Paste Application
