U.S. Invention Patent Authorization: "Reinforced Micro/Nanoparticle Composite Solder and Its Preparation Method" Developed by Fitech

2022-05-24

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U.S. Invention Patent Authorization: "Reinforced Micro/Nanoparticle Composite Solder and Its Preparation Method" Developed by Fitech

Shenzhen Fitech received a message related to patent application result from the United States Patent and Trademark Office (USPTO) on May 10th. It is excited to announce that reinforced micro/nanoparticle composite solder and its preparation method (PCT/ CN2017/114887) developed by Shenzhen Fitech has gained the US patent application US16/482,301. It has been officially authorized by USPTO.

Fitech has always attached importance to the research and development of new technologies and the layout of intellectual property rights. It has now become the world's leading ultra-fine solder development and production enterprise. Fitech has been making unremitting efforts to provide customers with the best technology. This U.S. invention patent authorization represents that Fitech's ultra-fine solder has been further recognized by the international market and has made further progress in the global ultra-fine solder technology layout.

Since its establishment, Fitech has always insisted on independent innovation. After more than 20 years of continuous experience accumulation, Fitech has become the outstanding one in the global microelectronics and semiconductor packaging solder manufacturing. It has taken the lead in the field of ultra-micro soldering materials. Fitech is the only manufacturer that can produce T2 to T10 solder powders. It has applied its advanced technology to a variety of products. Fitech is committed to providing partners with professional and high-level products, technologies, and services.

US Patent Application No.：US 16/482,301

U.S. Invention Grant Day：2022-05-10

U.S. Invention Patent Number：US 11,325,210

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