Ultra-Fine Solder Paste Assists in Mini/Micro LED Display Development
2022-05-20
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Ultra-Fine Solder Paste Assists in Mini/Micro LED Display Development
- Fitech's T8 Ultra-Fine Lead-Free Printing Solder Paste Attracts Wide Attention
On May 19, a seminar with 30 companies to deeply discuss new ideas for the development of mini/micro LED came to a successful conclusion in Shenzhen. Mr. Xu Pu, general manager of Shenzhen Fitech, attended the seminar and delivered a keynote speech after the invitation of Yashi International Consulting.
Shenzhen Fitech shared with its peers the choice of mini/micro LED packaging solder and explained the advantages of ultra-fine lead-free solder.
Fitech demonstrated the application of ultra-fine lead-free solder paste, which can achieve a dispensing size of 50μm.
To satisfy the requirements of ultra-fine and high-yield mini/micro LED packaging, Fitech brought a T8 ultra-fine printing solder paste product designed and developed for mini/micro LED, which has received much attention. Fitech's mLED 1370/ 1550 printing solder paste is produced using the ultra-fine spherical solder powder liquid phase molding technology, which provides a T8 lead-free solder paste solution for mini/micro LED packaging. Fitech's mLED 1370/ 1550 printed solder paste has a smaller stencil opening and higher reliability than T7 solder paste.
Fitech is a high-tech enterprise specializing in the development, production, and sales of ultra-fine solder paste and epoxy solder paste. The advanced ultra-fine spherical solder powder liquid phase molding technology can produce T6-T10 high-quality ultra-fine solder powders. Fitech has been involved in ultra-fine solder development (solder powder and solder paste) for more than 20 years, serving global customers. Fitech provides reliable ultra-fine soldering materials for microelectronics and semiconductor packaging.
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