Fitech’s Ultra-Fine Solder Paste Improves Ultra-Fine-Pitch Soldering Efficiency_Shenzhen Fi

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Ultra-Fine Medium and High Temperature Solder Paste

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T8 Ultra-Fine Solder Paste

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Low-Temperature Ultra-Fine Epoxy Solder Paste

Medium and High Temperature Ultra-Fine Epoxy Solder Paste

Anisotropic Conductive Paste

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Low-Temperature Lead-Free Solder Paste for Secondary Reflow Soldering

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Epoxy Flux

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High-Temperature Leaded Solder Paste

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SAC305

SnBiAg Solder Paste/Epoxy Solder Paste

Low-Temperature High-Reliability Solder Paste/Epoxy Solder Paste

Lead-Free Silver-Free Solder Paste/Sn-Cu Solder Paste

High-Temperature Lead-Free Solder Paste

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Ultra-Fine Solder Powder

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MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING

INTEGRATED CIRCUIT PACKAGING

MEMS PACKAGING

POWER DEVICE PACKAGING

SAC305 Ultra-Fine Die Bond Solder Paste

Low-Temperature Ultra-Fine Die Bond Solder

High-Strength Ultra-Fine Die Bond Solder Paste

Fitech Anisotropic Conductive Adhesive (FACA)

Ultra-Fine-Pitch Flux

Flip-chip Die Bond Solder Paste

FPC Low-Temperature Epoxy Solder Adhesive

Low-Alpha High-Lead Solder

Lead-Free Silver-Free Solder for SiP

Water-Soluble Solder Paste for SiP

Low-Alpha Lead-Free Solder

Ultra-Fine-Pitch Flux

SAC305 Series Solder Paste

Low-Temperature Solder Paste for Component Mounting

Low-Temperature Epoxy Solder Paste for Component Mounting

MCU Packaging Solder

Gold-Tin Solder Paste for MEMS Packaging

Solder for MEMS Reflow Soldering

High-Reliability Low-Temperature Solder Paste

High-Reliability Low-Temperature Epoxy Solder Paste

Water-Soluble Laser Solder Paste

Low-Temperature Epoxy Solder Paste for Camera Modules

Au80Sn20 Gold-Tin Solder for Power Devices

High-Temperature Lead-Free Solder Paste for Power Devices

Water-Soluble Solder Paste for Power Devices

Conventional Solder for Power Devices

MINI/MICRO LED PACKAGING

AUTOMOTIVE ELECTRONICS

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IOT & WEARABLES

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MILITARY & AEROSPACE

MEDICAL EQUIPMENT

Low-Temperature Solder for Mini LED Die Bond

Medium-Temperature Solder for Mini LED Die Bond

High-Strength Low-Temperature Solder for Mini LED Die Bond

COB Flip-chip Packaging Solder

FPC Low-Temperature Packaging Solder

BGA Flux for Mini/Micro LED

PCBA Solder

Automotive Power Module Packaging Solder

In-Vehicle Infotainment Packaging Solder

Automotive LED Packaging Solder

Automotive MEMS Packaging Solder

MCU Packaging Solder for Automotive Electronics

Rail Transit IGBT Packaging

SiP Solder for Baseband Chips

High-Reliability Packaging of Memory Chips

RF Power Device Packaging

PCBA Packaging

Multiple Reflow Packaging

IoT Security Chips and Payment Chips SiP

IoT Identity Verification and MEMS SiP

RF Power Devices and Chips Packaging

PCBA Packaging

MCU Packaging

Camera Modules Packaging

No-Clean Solder Paste/ Solder Adhesive for 3C Products

High-Reliability Water-Soluble Solder Paste for 3C Products

High-Strength Low-Temperature Solder Paste/Epoxy Solder Adhesive

MCU Packaging Solder for 3C Products

High-Reliability High-Temperature Solder (Au80Sn20)

Low alpha High-Lead Solder for High-Reliability Packaging

Au80Sn20 Solder Paste

Medical Equipment SiP

Laser Solder for Complex Structures

Precision Structures Low-Temperature Packaging

MCU Packaging

Low-Temperature Solder for Mini LED Die Bond

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