Integrated circuit packaging provides mechanical and electrical connections for IC chips. It also supplies physical protection. As a result, the integrated circuit chips have a stable and reliable operating condition. With the packaging development, manufacturers have adopted various advanced packaging technologies such as system-in-package (SiP) and system-on-chip (SoC), followed by a series of new challenges for packaging materials such as chip miniaturization, yield improvement, and cost reduction. Fitech provides reliable solder and solution support for integrated circuit packaging in various fields.

SiP Solution

Low-alpha high-lead solder series is developed by Fitech based on customer requirements. Tiny amounts of alpha particles emitted by packaging materials can cause soft errors and adversely impact miniaturized high-reliability devices. As a result, packaging materials must have a low alpha particle count. Fitech's T3 to T6 low-alpha products include Sn5Pb92.5Ag2.5, Sn5Pb95, and other alloys. Fitech’s low-alpha high-lead solder products have the advantages of outstanding solder powder sphericity, narrow particle size distribution, low oxygen content, and high chemical purity. The alpha particle emission strictly follows the specifications. Fitech is willing to provide customized development services if it is necessary.

Low α 高铅锡粉

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1. RoHS-exempt and high-reliability products;

2. Low alpha particle count meeting the particle emission specifications;

3. T3 to T6 solder products ensuring outstanding printing performance with different pitches;

4. Excellent sphericity, Uniform particle size distribution, and low oxygen content;

5. Solder coating to provide superior anti-oxidation performance and extraordinary solder stability.

Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product