Ultra-fine solder powder refers to T6 to T10 solder powder based on alloy particle sizes. With the development of microelectronics and semiconductor packaging technology, electronic-grade packaging has been widely applied. At present, ultra-fine solder powder is developed to adapt to the upgrade of the microscopic electric display, automotive electronics, Internet of Things, consumer electronics, SiP, and other fields.
Fitech is the world's leading supplier of ultra-fine solder powder and is the only packaging material supplier that can produce T2 to T10 electronic-grade solders. Fitech's ultra-fine solder powder covers a variety of alloys and soldering temperatures. The ultra-fine solder powder products have excellent sphericity, narrow particle size distribution, low oxygen content, and high reliability. Fitech provides customized services for customers.
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