With the development of flip-chip, an increasing number of LED chips need to be assembled on panels. Mass transfer is still one of the crucial technologies in the fine-pitch mLED display industry that needs to be overcome. Size and time are the main considerations in selecting lead-free solder paste for flip-chip LED.
Firstly, smaller chips and pads require further reduction in solder paste characteristic sizes.
Secondly, lead-free solder paste needs to stay in an indoor environment for a longer time before reflow, and the "pause-response" behavior is different from the traditional SMT process.
Fitech's lead-free solder paste for ultra-fine-pitch die bond is effective to maintain its excellent performance under long residence time and "pause-response" process. Fitech simulates the die bond process in the development stage of solder paste. The design and production of solder products strictly follow the most stringent standards.
