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The Internet of Things (IoT) has been widely regarded as the third wave of development in the information industry. IoT interconnects everything, in reality, to form a network through the perception layer, network layer, platform layer, and application layer, which will significantly influence the entire world. Fietch provides customers in the IoT field with packaging materials and solutions for IoT security chips, mobile payment chips, RF chips, identification chips, and MEMS.

Related applications

IoT Identity Verification and MEMS SiP
RF Power Devices and Chips Packaging
PCBA Packaging
MCU Packaging

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