MICRO-PHOTOELECTRIC (DISPLAY) PACKAGING
Mini/Micro LED generally refers to LED display technology with a chip size within 200/50um and a pixel pitch less than 1.0mm.
Mini/Micro LED generally refers to LED display technology with a chip size within 200/50um and a pixel pitch less than 1.0mm.
Integrated circuit packaging provides mechanical and electrical connections for integrated circuit chips, and meanwhile provides physical protection for integrated circuit chips. As a result, the integrated circuit chips have a stable and reliable operating condition.
MEMS (Micro Electron Mechanical System) refers to micro-devices and systems that consist of micro-sensors, actuators, signal processing, mechanical structures and other devices.
Power semiconductor devices, also known as power electronic devices, are mainly used for power conversion and control of power equipment.
Our Engineers Will be Happy to Answer Your Questions or Help You Choose the Right Solder Product
Fitech websites use cookies to deliver and improve the website experience, See our cookie policy for further details on how we use cookies and how to change your cookie settingsCookie policy.
Reject