Integrated circuit packaging provides mechanical and electrical connections for IC chips. It also supplies physical protection. As a result, the integrated circuit chips have a stable and reliable operating condition. With the packaging development, manufacturers have adopted various advanced packaging technologies such as system-in-package (SiP) and system-on-chip (SoC), followed by a series of new challenges for packaging materials such as chip miniaturization, yield improvement, and cost reduction. Fitech provides reliable solder and solution support for integrated circuit packaging in various fields.

SiP Solution

The low alpha lead-free solder is a lead-free solder with a low alpha particle count developed by Fitech. Low alpha solder can effectively reduce system soft errors, which makes it suitable for high-density SiP, flip-chip, and other packaging processes requiring high system reliability.

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