Fitech produced lead-free solder paste under the idea of "lead-free electronics" which refers to the solder paste that the total concentration of toxic and harmful substances including mercury (Hg), cadmium (Cd), hexavalent chromium (Cr), lead (Pb), polybrominated biphenyl (PBB), polybrominated diphenyl ether (PBDE)) should not exceed 1000ppm. Lead-free solder paste should have outstanding wettability, solderability, electrical conductivity, and thermal conductivity. Moreover, it should have extraordinary reliability, compatibility, and economic benefit.
Lead-free solder pastes developed for different scenarios include the SAC305 series, tin-bismuth-silver series, lead-free silver-free series, high-temperature lead-free series, low-temperature high-reliability series, and gold-tin solder paste. All products have been widely used in microelectronics and semiconductor packaging.
The main alloy of FWS-305P water-soluble solder paste is tin-silver-copper (SAC305). The water-soluble solder paste product is prepared by mixing T5, T6, T7, or T8 alloy powder with halogen-free environmental-protection flux.
1. The alloy has excellent sphericity, uniform particle size, and low oxygen content;
2. Outstanding halogen-free flux is used;
3. It has superior adhesion performance before soldering;
4. The solder paste has excellent viscosity stability and superior stencil life;
6. It is an ideal solder with extraordinary water cleaning performance for high-reliability micro-bump ultra-fine-pitch packaging.
After Curing:
Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
Warming Time: Return to warm for 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-55%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25 and 40℃.
FSA-305P series medium-temperature ultra-fine solder paste products (epoxy SAC solder paste) are composed of SAC305 solder powder and halogen-free flux. The amount of solvent evaporate can be reduced during soldering and solidifying. There is no solder ball formation after soldering. The solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. Compared with rosin solder paste, the solder residue of FSA-305P becomes thermosetting adhesive to strengthen the solder joint and enhance the anti-corrosion and insulation performance. FSA-305P is a no-clean and superior solder for medium-temperature soldering.
1. Before Curing:
2. After Curing：
Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.
FWS-305L water-soluble laser solder paste is formulated with SAC305 solder powder and excellent halogen-free water-soluble flux. FWS-305L has superior adhesion performance before soldering, which can meet the laser soldering process requirement. In addition, the product has many advantages like excellent soldering effect, no spatter, and outstanding water solubility, which makes it suitable for high-reliability micro-bump ultra-fine-pitch packaging.
Before Curing：
After Curing:
Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-60%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Cleaning Instruction: There is a small amount of residue around the pad after reflow, which should be cleaned with deionized water as soon as possible. The temperature of deionized water is between 25°C and 60°C .
FSA-305D series medium-temperature fine-pitch ultra-fine solder paste (SnAgCu epoxy solder paste) is composed of SAC305 solder powder and halogen-free flux. Only a tiny amount of solvent evaporates during the soldering and solidification process. There is no solder ball formation after soldering. The solder powder melts and shrinks, and the solder joints are metallurgical connections, which are equivalent to the soldering effect of solder paste. Compared with rosin solder paste, the solder residue becomes thermosetting adhesive to enhance the solder joint strength, corrosion resistance, and insulation. FSA-305 is a type of no-clean solder paste. It is a superior solder for medium temperature soldering.
1. Before Curing:
2. After Curing：
Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment;
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Stencil Cleaning Solvent: Ether. Propylene glycol monomethyl ether (PM) is preferred.
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTD-305 series solder paste. The solder paste has superior adhesion before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTD-305 has outstanding wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. The product is an ideal solder for micro-bump ultra-fine-pitch packaging.
1. Before Curing:
2. After Curing：
Product DIsplay of FTD-305 (Lead-Free Solder Paste for Dispensing)
Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
Fitech produces SAC305 solder powder with excellent sphericity, uniform particle size, and low oxygen content, and it is mixed with halogen-free flux to prepare FTP-305 series solder paste. The solder paste has a superior adhesion effect before soldering. Solvent volatilizes very slightly during soldering. Moreover, FTP-305 has outstanding wettability, anti-slump, and residue reduction properties. There is no solder ball formation during soldering. The product is ideal for micro-bump ultra-fine-pitch packaging.
1. Before Curing:
2. After Curing：
Warming Method: The sealed solder paste should rewarm to room temperature naturally; Rewarm no more than twice.
Warming Time: Rewarm 2 to 3 hours at room temperature. The actual time required to reach thermal equilibrium varies by vessel size.
Note: Do not open the bottle cap without sufficient rewarming or shorten the rewarming time by using heating equipment.
Operating Environment: The best operating temperature and humidity are 20-25°C and 40-50%RH, respectively. Reflow soldering in a nitrogen atmosphere is recommended.
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