Organic matter in the solder paste creates bubbles during the heat reflow process, leading to the formation of pores in the solder joint. The porosity reduces the strength, electrical and thermal cond
2023-10-13Printing position is correct or not (printing accuracy), the amount of solder paste, the amount of solder is uniform, whether the graphic of the paste is clear, there is no sticking, PCB surface is st
2023-10-11Desoldering refers to the reflow soldering process in which one or more pins of a component do not make normal contact with the pad, resulting in an incomplete or missing solder joint.
2023-10-09Double-sided mounting process can improve the actual utilisation of PCB, reduce manufacturing costs, and meet the demand for miniaturisation and high integration of end products. But the use of double
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