Solder Paste for Mini LED Package-Fitech Solder Paste



Solder Paste for Mini LED Package

Mini LED is a new type of display technology that uses 50-200 micron LED chips as backlight or pixel units, achieving excellent display effects such as high brightness, high contrast and high colour gamut, etc. The chip package process of Mini LED mainly adopts flip-flop package, whereby the LED chip is inverted on a carrier board and solidified and electrically connected by solder paste or solder adhesive. This process not only eliminates the step of gold wire bonding, but also improves the heat dissipation performance and reliability of the chip.


Due to the small size of Mini LED chips, the requirements for solder paste solder are higher, including particle size, melting point, wettability, void rate and residue. Currently on the market commonly used Mini LED packaging solder paste solder is mainly divided into two types: medium temperature solder and low temperature solder.


Medium temperature solder refers to the melting point between 200-250 degrees Celsius lead-free alloy solder, the most common is SAC305 (Sn96.5Ag3Cu0.5) alloy. This alloy has good wettability and solder strength and is suitable for use in the form of solder paste or solder glue (epoxy resin based solder paste). The advantage of medium temperature solder is that it is compatible with traditional SMT processes and can be soldered using existing equipment and parameters. The disadvantage is the higher melting point, which may cause thermal stress and thermal damage to the LED chip and carrier board.


Low-temperature solder refers to lead-free alloy solder with a melting point below 200 degrees Celsius, the most common being the SnBi/SnBiAg series of alloys. The melting point of this alloy is only 139 degrees Celsius, nearly 80 degrees Celsius lower than SAC305, which can effectively reduce the thermal impact on the LED chip and the carrier board, improve the quality and reliability of welding. The advantage of low-temperature solder is that the thermal stress is small, suitable for high-density, high-precision Mini LED package. The disadvantage is poor wettability, requiring the use of special fluxes and equipment for soldering.


Fitech 8 Powder Mini LED Medium and Low Temperature Solder Paste Product Series

Shenzhen Fitech is the world's leading manufacturer of microelectronics and semiconductor packaging ultra-fine solder, its medium temperature solder paste Fitech mLED 1550 (T8) with SAC305 (Sn96.5Ag3Cu0.5) solder alloy, melting point between 217-219 degrees Celsius, with good solder strength and wettability.


Fitech mLED 1370 (T8) low temperature solder paste adopts tin-bismuth-silver alloy (Sn42Bi57.6Ag0.4), which has the advantage of low-temperature soldering, low requirement for high temperature resistance of the device, and can be used for secondary reflow. As Sn42Bi57.6Ag0.4 adds 0.4Ag, its soldering performance and post-solder reliability is better than Sn42Bi58. For higher reliability, you can choose our tin glue products, which use epoxy resin around the solder joints to form a reinforcing effect.


FT-170/180/200 low-temperature solder paste is a kind of low-temperature solder with both low-temperature and mechanical reliability, the melting point can be selected from 170/180/200°C. Unlike traditional tin-bismuth-silver alloys (Sn42Bi57.6Ag0.4) and tin-bismuth alloys (Sn42Bi58), the brittleness of the solder joints is smaller. The product uses micro and nano metal particles to change the metal behaviour during the formation of the soldered alloy to improve the soldering effect and can be used for secondary reflow. It has been patented in the United States and Japan.

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