The Application of Ultra-Fine Solder Pastes in New Display
In recent years, China's new display industry has developed rapidly. The industrial chain has gradually improved and has a development trend of agglomeration. Beijing-Tianjin-Hebei, the Yangtze River Delta, the southeast coast, and the central-western regions have established the industrial development models, forming leading enterprises-major projects-industrial chain-industrial agglomeration-industrial base cluster development model in the new display.
If considering hardware, the LED display panel is the core component of the LED display system because it integrates four basic bottom support technologies of LED chips, LED chip packaging, driver IC chips and packaging, and PCB boards. Therefore, it is believed that the emergence, development, and application of new LED display technologies are based on the breakthrough of the bottom support technologies. The continuous breakthrough of bottom support technology has promoted the development of new technologies in the LED field. Fundamental technology improvement often motivates disruptive changes in the industry.
The value of the packaging has grown significantly. The supply chain components such as equipment, chips, panels, and packaging accessories are all beneficiaries. As the bridge connects upstream and downstream industries, the value of packaging accessories has increased dramatically. With the shrinking of chip size, the workload of chip accessories has massively increased. Efficiency and yield have become key factors affecting the quality and cost of the products, which means that the value of packaging accessories in the industry chain has increased.
Suitable soldering materials are indispensable for SMD, IMD, and COB. Since the chip size and pitch are constantly shrinking, tiny and regular solder powders and solder pastes are needed to meet reliable soldering requirements.
Fitech is the world's leading supplier of ultra-fine solder powders and solder pastes. It has an advanced production line of ultra-fine solder powders. Ultra-fine tin-based solder products have the advantages of high purity, uniform particle size distribution, excellent sphericity, and stable quality. Fitech is currently the only packaging material supplier that can produce T2-T10 electronic-grade solders.
With the decline of the pitches, the production technology of fine-pitch products has gradually matured, and the market size of the commercial display continues to expand. The COB packaging technology enables LED display products to enter more medium and high-end display places. Mini-LED and micro-LED technologies accelerate the implementation of home color TVs, e-sports screens, and automotive displays. In the future, with the upgrading of technology, the market will have new opportunities. The rise of the metaverse concept stimulates the construction of new market systems. Display devices will become a leading role. The LED display requires opportunities in technology development and innovative applications.