RFID Tag Packaging Solder - FACA Anisotropic Conductive Paste
Solder for RFID Tag Packaging - FACA Anisotropic Conductive Paste
Radio Frequency Identification (RFID) is one of the core technologies of the Internet of Things (IoT).
RFID tags are widely used in security, access control, automation, retail, medical, identification, anti-counterfeiting, automotive, military, asset management, etc.
The packaging of RFID tags generally adopts the flip-chip method. The RFID chips and the tag antennas are packaged on the paper or PET substrate.
The packaging processes of RFID tags generally include: unloading, dispensing, flip-chip bonding, hot pressing, and module testing. The connecting material used is anisotropic conductive paste (ACP).
Fitech's FACA-138 series is an ultra-fine ACP product with a low melting point.
FACA-138 is produced by using SnBiAg alloy with a melting point of 139°C as conductive particles, mixing with a special flux. The ultra-fine solder powder particle is prepared using liquid phase molding technology. The minimum particle size of FACA-138 can reach T10 (1-3 μm) and has a narrow size distribution. It is suitable for chip bonding with a minimum pad pitch of 15μm. It is available for the packaging of RFID chips.