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​ The Introduction of SAC305 Ultra-Fine-Pitch Die Bond Solder Paste

2022-04-24

 The Introduction of SAC305 Ultra-Fine-Pitch Die Bond Solder Paste

Die bond refers to fixing the LED chip to the fixed position of the frame or substrate through adhesive or die bond solder paste.

 

With the development of mini-LED backlights and direct display technology, die-bonding technology is also used in mini-LED backlights, mini-LED direct display TV, and display packaging. Generally speaking, the pitch size differences between ordinary LEDs and ultra-fine-pitch LEDs are large (P>1.0mm). The mini-LED chips (backlight and direct display) are small and have an ultra-fine pitch.

 

SAC lead-free solder paste is one of the main lead-free solder paste substitutes for SnPb eutectic solder paste and has been widely used in the market. SAC305 lead-free solder paste is applicable to LED packages in most cases.

 

(Direct display or backlight) Mini-LED has the characteristics of small chip size and fine chip pitch. SAC305 ultra-fine solder pastes with particle sizes above T6 can be used for mini-LED.

 

According to the size of the solder powder alloy, the SAC305 ultra-fine-pitch die bond solder pastes include T6 (5-15μm), T7 (2-11μm), T8 (2-8μm), T9 (1-5μm), and T10 ( 1-3μm).

 

The SAC305 ultra-fine solder paste products currently used in mini-LEDs mainly include Heraeus’ T6 and T7 SAC ultra-fine solder pastes, Indium’s T6, and T7 SAC ultra-fine solder pastes, and Fitech’s T6, T7, and T8 SAC ultra-fine solder pastes.

 

Compared with SnPb eutectic solder paste (melting point of 183°C), the melting point (217-219°C) of SAC305 ultra-fine-pitch die bond solder paste is 34-36°C higher.

 

In addition to temperature, it is compulsory to obey the 3, 5, and 8-ball principles to ensure the reliability of solder joints.


The Introduction of SAC305 Ultra-Fine-Pitch Die Bond Solder Paste

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