​ Ultra-Fine Epoxy Solder Paste for CMOS - Shenzhen Fitech


 Ultra-Fine Epoxy Solder Paste for CMOS - Shenzhen Fitech


The camera module refers to the optical and optoelectronic devices that can convert optical signals into electrical signals. A mobile phone camera module is composed of a CMOS sensor, lens, and IF interface. The function of these components is to input pictures or videos into the mobile phone when taking pictures. The mobile phone processor comprehensively processes and analyzes the image data collected by the lens.


CMOS mobile phone camera modules contain MEMS and circuit chips, which require a certain air tightness, low-temperature soldering ability, and excellent drop resistance. Low-temperature soldering can reduce the warping of CMOS photosensitive elements. The common soldering materials used for camera modules include low-temperature rosin-based lead-free solder paste and low-temperature epoxy-based solder paste products.


The ultra-fine epoxy solder paste for CMOS is compatible with dispensing, tinning, and other processes. The special solder paste for CMOS soldering has different particle sizes, including T6 (5-15μm), T7 (2-11μm), T8 (2-8μm), and T9 (1-5μm).


Since the epoxy solder paste adopts epoxy resin to strengthen the solder joints, the anti-drop performance has been effectively enhanced. Meanwhile, the epoxy solder paste with excellent electrical insulation and protection properties makes it suitable for CMOS soldering.


Fitech’s epoxy solder paste for CMOS mobile phone camera modules has shown outstanding drop resistance and temperature cycle stability in practical applications.


Ultra-Fine Epoxy Solder Paste for CMOS

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