Solder Paste Commonly Used for Solder Heating_Fitech Solder Paste
Solder Paste Commonly Used for Solder Heating
Solder paste is a mixture used to connect electronic components to printed circuit boards (PCBs) and is mainly composed of tin powder and flux. There are mainly the following solder heating methods for solder paste:
Reflow soldering is a soldering technique that uses heat such as hot air or infrared rays to heat the solder paste printed or dotted on the printed circuit board until it melts, forming a metallurgical connection with the components and pads. The tool for reflow soldering is usually a reflow oven consisting of a heating element and a fan. The reflow oven can be controlled according to different temperature profiles to accommodate different solder paste and component characteristics. The advantage of reflow soldering is that it can achieve large-area, high-density and high-precision soldering, which is suitable for soldering surface-mounted components (SMC/SMD) in SMT.
Figure 1. Reflow oven appearance
Laser soldering is a technology that uses a laser beam as a heat source to rapidly heat the solder paste locally or in a tiny area until it melts, achieving precision soldering. The tool for laser soldering is usually a laser head consisting of a laser generator and a spotting mirror, also known as a laser gun. The laser head can be adjusted for different powers and wavelengths to suit different paste and component characteristics. The advantages of laser soldering are that it enables high precision, high efficiency and low pollution soldering, and is suitable for micro components and high density circuit boards.
Hot Bar soldering is a technology that uses a hot press to apply pressure and temperature to the solder paste, causing it to undergo plastic deformation and solid-phase diffusion simultaneously with the components and pads to form a metallurgical bond. The advantage of hot press soldering is that it can achieve low-temperature, low-stress, high-strength soldering, and is suitable for FPC flexible circuit boards and thin-film components.
Figure 2. Hot melt machine for thermocompression soldering
It mainly includes electric soldering iron and hot air gun heating. The electric soldering iron heats the tip of the soldering iron by means of an electric hot wire, and then the tip of the soldering iron is touched to the soldering point to melt the solder paste to form a weld.
The hot air gun heats the soldering joint by spraying hot air. Suitable for manual operation or small batch production of electronic components in the welding. Manual soldering equipment is relatively inexpensive and easy to maintain, and is suitable for manual operation or small batch production of electronic components soldering.
Shenzhen Fitech Co., Ltd. is a global leading microelectronics and semiconductor packaging materials solutions provider, Fitech solder paste products with good sphericality, uniform particle size distribution, excellent wettability, adjustable viscosity, support a variety of alloys and custom, particle size covers T2-T10, to meet different application requirements. Welcome to contact us.